The advanced course of the practical route of circuit board hardware design
Primary Practice 1. Welding. First look at the welding video of the predecessors. When dragging and soldering, first align the chip, then fix one corner with tin, then fill the other side with tin, and finally fill the entire chip with tin. Pick up the board, tilt it about 30 degrees, heat it with a soldering iron, suck up the tin that has become liquid, and shake it off until all the tin is sucked away. The temperature of the soldering iron should be adjusted properly, I usually use 350 degrees Celsius. The key point is to understand that when tin becomes liquid, it will flow down under the action of gravity like water. Also, the surface of the soldering iron tip has suction, so do not scrape the tin hard during the entire soldering process. If the operation is not smooth when welding, you can turn the board. Regarding BGA soldering, manual operation is generally not recommended, because the success rate is not high, and a rework station is recommended. Let me talk about the oper...